Introduction to BLE Module--TYBT2

Introduction to BLE Module–TYBT2

1.Product Overview

TYBT2 is a Bluetooth (BLE) module designed by HangZhou Tuya Technology Corporation. The BLE Module consists of a highly integrated wireless Bluetooth chip TLSR8266 and some extra electric circuits that have been programed with Bluetooth network protocol and plenty of software examples. TYBT2 include a 32-bit CPU, BLE/2.4G radio, 512K byte flash, 16k SRAM, and 9 multiplex IO pins.

Figure 1 shows the block diagram of the TYBT2.

Figure 1. The block diagram of the TYBT2

​ Figure 1. The block diagram of the TYBT2

1.1 Features

  • Integrated low power consumption 32-bit CPU, also known as application processor
  • Basic frequency of the CPU can support 48 MHz
  • Supply voltage range: 1.9V to 3.6V
  • Peripherals: 5PWM, 1I2C, 1*UART
  • BLE RF features:

​ Compatible with BLE 4.0

​ Transmitting data rate can go up to 2Mbps

​ TX transmitting power: +7dBm

​ RX receiving sensitivity: -92dBm

​ AES hardware encryption

​ On-board PCB antenna

​ Operating temperature range: -20℃ to 85℃

1.2 Main Application Fields

  • Intelligent LED

  • Intelligent household applications

  • Intelligent low-power consumption sensors

2. Dimensions and Footprint

2.1 Dimensions

TYBT2 have double sides of pins. The distance between each Pin is 2.0mm.

Size of TYBT2: 15mm(W)*16.5mm(L).

Figure 2 shows the dimensions of TYBT2.

2.2 Pin Definition

Table 1 shows the general pin attributes of TYBT2

​ Table 1. The typical pin definition of TYBT2

1 SDA I/O I2C, data interface, internal pull-up 4.7k resistance
2 SCL I/O I2C, clock interface, internal pull-up 4.7k resistance
3 G I/O normal IO pin, can be used as PWM output pin, default for Green LED line
4 B I/O normal IO pin, can be used as PWM output pin, default for Blue LED line
5 WW I/O normal IO pin, can be used as PWM output pin, default for Warm White LED line
6 CW I/O normal IO pin, can be used as PWM output pin, default for Cold White LED line
7 R I/O normal IO pin, can be used as PWM output pin, default for Red LED line
8 3.3V P Supply voltage
9 TX I/O UART TX,can be used as normal IO pin
10 RX I/O UART RX,can be used as normal IO pin
11 GND P Ground
12 SW I/O Bluetooth chipset burning pin
13 RST I reset pin for the module,internal pull-up 4.7k resistance
14 GND P Ground

​ Note:P: Power supply pins; I/O: Digital input or output pins.

​ SW pin is ONLY used for burning firmware, Can NOT be used for other functions.

​ While Pin4 and Pin12 are used for I2C functions, external 4.7k pull-up resistances are necessary.

​ When WW pin is outputting PWM signal, It has opposite phase comparing the PWM signal from R/G/B/CW pin.

​ If there’s any customization needed for PWM output, please contact our BD manager.

3. Electrical Characteristics

3.1 Absolute Maximum Ratings

​ Table 2. Absolute Maximum Ratings

Ts Storage temperature -20 85
VCC Supply voltage -0.3 3.9 V
Electrostatic release quantity (Human body model) TAMB-25℃ - 2 KV
Electrostatic release quantity (Machine model) TAMB-25℃ - 0.5 KV

3.2 Electrical Conditions

​ Table 3. Electrical Conditions

Ta Temperature for Commercial grade -20 - 85
VCC Supply voltage 2.5 3.3 3.6 V
VIL IO negative level input -0.3 - VCC*0.25 V
VIH IO positive level input VCC*0.75 - VCC V
VOL IO negative level output - - VCC*0.1 V
VoH IO positive level output VCC*0.8 - VCC V

3.3 Transmitting Current Consumptions

​ Table 4. TX current consumption

Itx Continuously transmitting, 0dBm power output 13 mA
Irx Continuously receiving 13 mA
IDC Normal working mode 80 uA

4. Radio Specification

4.1 Basic Radio Frequency Characteristics

​ Table 5. Basic Radio frequency characteristics

Working Frequency 2.4GHz ISM band
Radio standard BLE 4.0
Data transmitting rate 1Mbps, 2Mbps
Type of Antenna On-board PCB Antenna

4.2 Transmitting Power

​ Table 6. Transmitting power

RF Average output power consumption 3.8 7 - dBm
20dB bandwidth - 1000 - KHz

4.3 Receiving Sensitivity

​ Table 7. Receiving sensitivity

RX sensitivity 1Mbps -93 -92 -90 dBm
Frequency bias error - -300 - 300 KHz
Co-channel interference Restrain - - -7 - dB

5.Antenna Information

5.1 Antenna Type

Antenna for TYBT2 module is using 2.4 GHz MIFA On-board PCB antenna.

5.2 Reduce Antenna Interferencey

In order to have the best RF performance, it’s recommended to keep a minimum 15mm distance between the antenna part and the other metal pieces.

Since PCBA manufacture use SMT process to weld TYBT2 module and other electrical components onto the PCB board, RF performance will depend on the layout location and pattern of the On-board PCB antenna. The following figures are some recommended and dis-recommended demonstrations from out R&D team.

In demonstration 1 and 2 of figure 3, the on-board PCB antenna lays outside of the PCB frame. It’s recommended to use layout pattern shown in demonstration 1 and 2. Either the on-board PCB antenna lays outside of the PCB frame directly or PCB frame carve out a certain area for the antenna. The overall PCBA performance for these two ways will be the same as testing the module independently.

Restricted due to some reason, if the on-board PCB antenna layout has to be inside the PCB frame, it’s suggested to refer to demonstration 3. The antenna lays inside the PCB frame, but no copper or wire beneath the antenna. RF performance will have some loss, approximately 1~2 dBm.

It’s NOT recommended to use demonstration 4, the antenna lays inside the PCB frame, and there are copper and wire beneath it. RF performance will have significant attenuation.

Figure 3. layout demostrations

6. Packaging Information And Production Guide

6.1 Mechanical Dimensions

​ Figure 4. Dimensions of the module

6.2 Production Guide

The storage for the delivered module should meet the following condition:

  1. The anti-moisture bag should be kept in the environment with temperature < 30℃ and humidity < 85% RH.
  2. The expiration date is 6 months since the dry packaging products was sealed.


  1. All the operators should wear electrostatic ring in the whole process of production.
  2. While operating, water and dirt should not have any contact with the modules.

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