Introduction to BLE Module--TYBT3
Introduction to BLE Module–TYBT3
TYBT3 is a Bluetooth (BLE) module designed by HangZhou Tuya Technology Corporation. The BLE Module consists of a highly integrated wireless Bluetooth chip TLSR8267 and some extra electric circuits that have been programed with Bluetooth network protocol and plenty of software examples. TYBT3 include a 32-bit CPU, BLE/2.4G radio, 512K byte flash, 16k SRAM, and 9 multiplex IO pins.
Figure 1 shows the block diagram of the TYBT3.
Figure 1. The block diagram of the TYBT3
- Integrated low power consumption 32-bit CPU, also known as application processor
- Basic frequency of the CPU can support 48 MHz
- Supply voltage range: 1.9V to 3.6V
- Peripherals: 5PWMs, 1I2C, 1*UART
- BLE RF features:
Compatible with BLE 4.0
Transmitting data rate can go up to 2Mbps
TX transmitting power: +7dBm
RX receiving sensitivity: -92dBm
AES hardware encryption
On-board PCB antenna
Operating temperature range: -20℃ to 125℃
1.2 Main Application Fields
Intelligent household applications
Intelligent low-power consumption sensors
2. Dimensions and Footprint
TYBT3 have double sides of pins. The distance between each Pin is 2.0mm.
Size of TYBT3: 16mm(W)*16.5mm(L).
Figure 2 shows the dimensions of TYBT3.
Figure 2. The dimensions of TYBT3
2.2 Pin Definition
Table 1 shows the general pin attributes of TYBT3
Table 1. The typical pin definition of TYBT3
|1||SDA||I/O||I2C, data interface, internal pull-up 4.7k resistance|
|2||SCL||I/O||I2C, clock interface, internal pull-up 4.7k resistance|
|3||G||I/O||normal IO pin, can be used as PWM output pin, default for Green LED line|
|4||B||I/O||normal IO pin, can be used as PWM output pin, default for Blue LED line|
|5||WW||I/O||normal IO pin, can be used as PWM output pin, default for Warm White LED line|
|6||CW||I/O||normal IO pin, can be used as PWM output pin, default for Cold White LED line|
|7||R||I/O||normal IO pin, can be used as PWM output pin, default for Red LED line|
|9||TX||I/O||UART TX,can be used as normal IO pin|
|10||RX||I/O||UART RX,can be used as normal IO pin|
|12||SW||I/O||Bluetooth chipset burning pin|
|13||RST||I||reset pin for the module,internal pull-up 4.7k resistance|
Note: P: Power supply pins; I/O: Digital input or output pins.
SW pin is ONLY used for burning firmware, Can NOT be used for other functions.
While Pin4 and Pin12 are used for I2C functions, external 4.7k pull-up resistances are necessary.
When WW pin is outputting PWM signal, It has opposite phase comparing the PWM signal from R/G/B/CW pin.
If there’s any customization needed for PWM output, please contact our BD manager.
3. Electrical Characteristics
3.1 Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings
|Electrostatic release quantity (Human body model)||TAMB-25℃||-||2||KV|
|Electrostatic release quantity (Machine model)||TAMB-25℃||-||0.5||KV|
3.2 Electrical Conditions
Table 3. Electrical Conditions
|Ta||Temperature for Commercial grade||-20||-||125||℃|
|VIL||IO negative level input||-0.3||-||VCC*0.3||V|
|VIH||IO positive level input||VCC*0.75||-||VCC||V|
|VOL||IO negative level output||VSS||-||0.3||V|
|VoH||IO positive level output||VCC*0.3||-||VCC||V|
3.3 Transmitting Current Consumptions
Table 4. TX current consumption
|Itx||Continuously transmitting, 0dBm power output||15||mA|
|IDC||Mesh working mode||27||mA|
4. Radio Specification
4.1 Basic Radio Frequency Characteristics
Table 5. Basic Radio frequency characteristics
|Working Frequency||2.4GHz ISM band|
|Radio standard||BLE 4.0|
|Data transmitting rate||1Mbps, 2Mbps|
|Type of Antenna||On-board PCB Antenna|
4.2 Transmitting Power
Table 6. Transmitting power
|RF Average output power consumption||3.8||7||8||dBm|
4.3 Receiving Sensitivity
Table 7. Receiving sensitivity
|Frequency bias error||1Mbps||-300||-||+300||KHz|
|Frequency bias error||2Mbps||-200||-||+200||KHz|
|Co-channel interference Restrain||-||-||-7||-||dB|
5.1 Antenna Type
Antenna for TYBT3 module is using 2.4 GHz On-board PCB antenna.
5.2 Reduce Antenna Interferencey
In order to have the best RF performance, it’s recommended to keep a minimum 15mm distance between the antenna part and the other metal pieces.
Since PCBA manufacture use SMT process to weld TYBT3 module and other electrical components onto the PCB board, RF performance will depend on the layout location and pattern of the On-board PCB antenna. The following figures are some recommended and dis-recommended demonstrations from out R&D team.
In demonstration 1 and 2 of figure 3, the on-board PCB antenna lays outside of the PCB frame. It’s recommended to use layout pattern shown in demonstration 1 and 2. Either the on-board PCB antenna lays outside of the PCB frame directly or PCB frame carve out a certain area for the antenna. The overall PCBA performance for these two ways will be the same as testing the module independently.
Restricted due to some reason, if the on-board PCB antenna layout has to be inside the PCB frame, it’s suggested to refer to demonstration 3. The antenna lays inside the PCB frame, but no copper or wire beneath the antenna. RF performance will have some loss, approximately 1~2 dBm.
It’s NOT recommended to use demonstration 4, the antenna lays inside the PCB frame, and there are copper and wire beneath it. RF performance will have significant attenuation.
Figure 3. layout demostrations
6. Packaging Information And Production Guide
6.1 Mechanical Dimensions
Figure 4. Dimensions of the module
6.2 Production Guide
The storage for the delivered module should meet the following condition:
- The anti-moisture bag should be kept in the environment with temperature < 30℃ and humidity < 85% RH.
- The expiration date is 6 months since the dry packaging products was sealed.
- All the operators should wear electrostatic ring in the whole process of production.
- While operating, water and dirt should not have any contact with the modules.