Introduction to BLE Module--TYBT4L
BLE module introduction–TYBT4L
1. Product Overview
TYBT4L is a low power-consuming built-in Bluetooth module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated Bluetooth chip (TLSR8267) and several peripheral electrical circuits, with a built-in Bluetooth network communication protocol stack and robust library functions. TYBT4L also contains a low power-consuming 32-bit MCU, a BLE/2.4 GHz radio, a 512 KB flash, a 16 KB SRAM, and nine multiplex I/O ports.
Figure 1.1 shows the architecture of TYBT4L.
Built-in low power-consuming 32-bit CPU, which can also be used as an application processor
- Basic frequency: 48 MHz supported
Working voltage:1.9 V to 3.6 V
Peripherals: one I2C interface, five PWMs, and one UART
BLE RF features
Compatible with BLE 4.2
RF data rate: up to 2 Mbit/s
TX power: +7 dBm
RX sensitivity: –92 dBm
Built-in AES encryption for hardware
Onboard PCB antenna
Working temperature: –20°C to +105°C
1.2 Major Application Fields
- Intelligent LED
- Intelligent home
- Industrial low-power sensor
2. Module Interfaces
2.1 Dimensions and Footprint
TYBT4L provides two rows of pins with the distance of 2.0 mm between every two pins.
TYBT4L dimensions: 16 mm (W) x 24 mm (L) (see figure 2.1)
2.2 Pin Definition
Table 2.1 describes the interface pins. Table 2.1 TYBT4L interface pins
|1||RST||I||Module reset pin|
|2||ADC||I||External analog input|
|3||NC||/||NC interface, which is not connected|
|4||SDA||I/O||Pin for the data line of the I2C interface, which must be connected to a 4.7 kΩ pull-up resistor. This pin can also be used as the common I/O interface.|
|5||B||I/O||Common I/O interface, which can be used for PWM output of the LED driver. It controls the blue LED by default.|
|6||G||I/O||Common I/O interface, which can be used for PWM output of the LED driver. It controls the green LED by default.|
|7||WW||I/O||Common I/O interface, which can be used for PWM output of the LED driver. It controls the warm white LED by default.|
|8||3.3 V||P||Module power supply input pin|
|9||GND||P||Module power supply reference ground pin|
|10||PA7||I/O||Used as the common I/O interface|
|11||SWS||I/O||Bluetooth chip programming pin|
|12||SCL||I/O||Pin for the clock line of the I2C interface, which must be connected to a 4.7 kΩ pull-up resistor. This pin can also be used as the common I/O interface.|
|13||R||I/O||Common I/O interface, which can be used for PWM output of the LED driver. It controls the red LED by default.|
|14||CW||I/O||Common I/O interface, which can be used for PWM output of the LED driver. It controls the cold white LED by default.|
|15||RX||I/O||Serial port TX pin, used as the common I/O interface|
|16||TX||I/O||Serial port TX pin, used as the common I/O interface|
Note: P indicates power-supply pins and I/O indicates input/output pins.
The SWS pin is used only for programming of module firmware.
The I2C pin does not provide a pull-up resistor. It must be connected to an external pull-up resistor.
When the WW pin is used for PWM output, its polarity is opposite to that of the R, G, B, and CW pins used for PWM output.
If you have special requirements for the light color controlled by PWM output, contact our business manager.
3.1 Absolute Electrical Characteristics
Table 3.1 Absolute electrical characteristics
|Parameters||Description||Minimum value||Maximum value||Unit|
|VCC||Power supply voltage||-0.3||3.9||V|
|Static electricity voltage (human model)||TAMB-25℃||-||2||KV|
|Static electricity voltage (machine model)||TAMB-25℃||-||0.5||KV|
3.2 Electrical conditions
Table 3.2 Normal electrical conditions
|Parameter||Description||Minimum Value||Typical Value||Maximum Value||Unit|
|VIL||I/O low-level input||–0.3||-||VCC*0.3||V|
|VIH||I/O high-level input||VCC*0.7||-||VCC||V|
|VOL||I/O low-level output||VSS||-||0.3||V|
|VoH||I/O high-level output||VCC–0.3||-||VCC||V|
3.3 Power Consumption in Operating Mode
Table 3.3 TX power consumption during constant emission
|Itx||Constant emission, with 0 dBm output power||15||mA|
4. RF Features
4.1 Basic RF Features
Table 4.1,Basic RF features
|Frequency band||2.4 GHz ISM band|
|Radio standard||BLE 4.2|
|Data transmitting rate||1 Mbps and 2 Mbps|
|Antenna type||Onboard PCB antenna|
4.2 RF Output Power
Table 4.2 TX power during constant emission
|Parameter||Minimum Value||Typical Value||Maximum Value||Unit|
|RF average output power||3.8||7||8||dBm|
|20 dB bandwidth (1 M)||-||1300||-||KHz|
|20 dB bandwidth (2 M)||-||2600||-||KHz|
4.3 RF RX sensitivity
Table 4.3 RX sensitivity
|Parameter||Minimum Value||Typical Value||Maximum Value||Unit|
|Frequency offset error||1Mbps||–300||-||+300||kHz|
|Frequency offset error||2Mbps||–200||-||+200||kHz|
|Co-channel interference suppression||-||-||–7||-||dB|
5. Antenna Information
5.1 Antenna types
TYBT4L uses the onboard MIFA antenna working in the 2.4 GHz Wi-Fi band for the PCB.
5.2 Antenna Interference Reduction
To ensure optimal RF performance, it is recommended that there be a space of at least 15 mm between the module antenna and other metal parts. TYBT4L is attached to the PCB with other components using the SMT. In this case, the routing position and method of the PCB antenna directly affect the RF performance. The following figures show the recommended and not recommended routing positions. As shown in Figure 5.1, if most of the antenna is outside the PCB frame, solutions 1 and 2 are recommended. The antenna is placed outside the PCB frame or the PCB is carved to reserve an area for the antenna. By using these two solutions, the performance of TYBT4L is almost the same as that of the module when being tested independently. If the antenna must be routed on the PCB due to restrictions, solution 3 is recommended. The antenna is placed inside the PCB frame and no copper or wire is routed near the antenna. If this solution is used, the performance is reduced by about 1–2 dBm. It is not recommended that solution 4 be used, in which the antenna is placed inside the PCB and copper and other wires are routed under the antenna. In this solution, the RF signal has significantly attenuation.
6. Packaging Information and Poduction Instructions
6.1Mechanical Dimensions and Size of the Back Pad
6.2 Production Instructions
Storage conditions of a delivered module are as follows:
- The anti-moisture bag is placed in an environment where the temperature is under 30°C and the relative humidity is under 85%.
- The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
- Throughout the production process, each involved operator must wear an electrostatic ring.
- During the operation, strictly protect the module from water and strains.