BLE Module Group Introduction — TYBT5

BLE Module Group Introduction — TYBT5

1. Product Overview

TYBT5 is a low power-consuming embedded Bluetooth module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated Bluetooth chip (TLSR8267) and a small number of peripheral circuits, with a built-in Bluetooth network communication protocol stack and robust library functions. TYBT5 also contains a low power-consuming 32-bit MCU, BLE/2.4G Radio, 512 KB flash, 16 KB SRAM, and nine reusable I/O interfaces. Figure 1.1 shows the architecture of TYBT5.

1.1 Features

  • Built-in low power-consuming 32-bit MCU, which can also be used as an application processor Basic frequency: 48 MHz supported
  • Working voltage: 1.9 V to 3.6 V
  • Peripheral equipment: one I2C, five PWMs, and one UART BLE RF
  • Zigbee features Compatible with BLE 4.2 RF data rate: up to 2 Mbit/s TX power: +7 dBm RX sensitivity: –92 dBm Built-in AES encryption for hardware Onboard PCB antenna Working temperature: -40°C to 105°C

1.2 Major Application Fields

  • Intelligent LED
  • Intelligent home
  • Intelligent low power-consuming sensors

2. Module Interfaces

2.1 Dimensions and Footprint

TYBT5 provides two rows of pins with the distance of 2.0 mm between every two pins. TYBT5 size: 14.8 mm (W) × 20.4 mm (L) Figure 2.1 shows the overall pin layout of TYBT5. Figure 2.1 Overall pin layout of TYBT5

2.2 Pin Definition

Table 2.1 describes the interface pin definition. Table 2.1 TYBT5 interface pins

No. Symbol I/O Type Functions
1 PWM1 I/O Common I/O interface, which can be used for PWM output of LED drives.
2 PWM0 I/O Common I/O interface, which can be used for PWM output of LED drives.
3 I2C_SDA I/O Data line pin of I2C, which can be used as a common I/O interface.
4 I2C_SCL I/O Clock cable pin of I2C, which can be used as a common I/O interface.
5 3.3 V P Module power-supply input pin
6 PB1 I/O Common I/O interface, which can be used for PWM output of LED drives.
7 GND P Module power-supply reference ground pin
0 SWS I/O Bluetooth chip programming pin
00 PWM4 I/O Common I/O interface, which can be used for PWM output of LED drives.
8 RX I/O Serial port receiving pin, which can be used as a common I/O interface.
9 RST I Module reset pin
10 3.3 V P Module power-supply input pin
11 TX I/O Serial port sending pin, which can be used as a common I/O interface.
12 PWM5 I/O Common I/O interface, which can be used for PWM output of LED drives.

Note: P indicates power-supply pins, and I/O indicates input/output pins. The SWS pin is used only for programming of module firmware. If you have special requirements for the light color controlled by PWM output, contact our business manager.

3. Electrical Characteristics

3.1 Absolute Electrical Characteristics

Table 3 .1Absolute electrical characteristics

Parameter Description Minimum Value Maximum Value Unit
Ts Storage temperature -20 125 °C
VCC Power-supply voltage -0.3 3.9 V
Static electricity voltage (human model) TAMB -25°C - 2 kV
Static electricity voltage (machine model) TAMB -25°C - 0.5 kV

3.2 Electrical Conditions

Table 3.2Normal electrical conditions

Parameter Description Minimum Value Typical Value Maximum Value Unit
Ta Working temperature -20 - 105 °C
VCC Working voltage 1.9 3.3 3.6 V
VIL I/O low-level input -0.3 - VCC x 0.3 V
VIH I/O high-level input VCC x 0.7 - VCC V
VOL I/O low-level output VSS - 0.3 V
VOH I/O high-level output VCC -0.3 - VCC V

3.3 Power Consumption in Operating Mode

Table 3.3 TX power consumption during constant emission

Symbol Condition Typical Value Unit
ITX Constant sending with 0 dBm output power 15 mA
IRX Constant receiving 12 mA
IDC Mesh connected 27 mA
Ideepsleep Sleep mode 18 uA

4. RF Features

4.1 Basic RF Features

Table 4.1 Basic RF features

Parameter Description
Frequency band 2.4 GHz ISM band
Radio standard BLE 4.2
Data transmitting rate 1 Mbit/s and 2 Mbit/s
Antenna type Onboard PCB antenna

4.2 RF Output Power

Table 4.2 TX power during constant emission

Parameter Minimum Value Typical Value Maximum Value Unit
RF average output power 3.8 7 8 dBm
20 dB occupied bandwidth (1 Mbit/s) - 1300 - kHz
20 dB occupied bandwidth (2 Mbit/s) - 2600 - kHz

4.3 RF RX Sensitivity

Table 4.3 RX sensitivity

Parameter Minimum Value Typical Value Maximum Value Unit
RX sensitivity 1 Mbit/s -93 -92 -90 dBm
RX sensitivity 2 Mbit/s -90 -89 -86 dBm
Frequency offset error 1 Mbit/s -300 - +300 kHz
Frequency offset error 2 Mbit/s -200 - +200 kHz
Co-channel interference suppression - - -7 - dB

5. Antenna Information

5.1 Antenna Types

The PCB antenna used by TYBT5 is an onboard PCB antenna in the 2.4 GHz Wi-Fi band.

5.2 Antenna Interference Reduction

To ensure optimal RF performance, it is recommended that the antenna on the module be at least 15 mm away from other metal parts. TYBT5 is attached to the PCB with other components using the SMT. The placement location and method of the PCB antenna directly affect the RF performance. The following figures show the recommended and non-recommended placement locations. In Figure 5.1, the antenna of TYBT5 is placed outside the PCB. It is recommended that solution 1 or solution 2 be used, in which the antenna is placed outside the PCB or in a hollow location alongside the PCB. By using these two solutions, the performance of TYBT5 is almost the same as that of the module when being tested independently. If the PCB antenna must be placed on the backplane, follow the layout in solution 3, in which the antenna is placed inside the PCB but no copper or cable wires are routed under the antenna. However, the RF performance has estimated attenuation of 1 dB to 2 dB. It is not recommended that solution 4 be used, in which the antenna is placed inside the PCB and copper and other wires are routed under the antenna, and the RF signal will be significantly attenuated. Figure 5.1 Placement of the TYBT5 antenna

6. Packaging Information and Production Instructions

6.1 Mechanical Dimensions and Size of the Back Pad

Figure 6.1 TYBT5 size diagram

6.2 Production Instructions

The factory storage conditions are as follows: 1.The anti-moisture bag must be stored in an environment with a temperature of less than 30°C and humidity of less than 85% RH. 2.The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed. Note: 1.During the whole process of production, the operator of each station must wear an electrostatic ring. 2.During the operation, strictly protect the module from water and strains.

400-881-8611