Title: Tuya Smart BLE Module Subtitle: TYBT8 Bluetooth Module Published: True

Tuya Smart TYBT8 Module

1. Product Overview

TYBT8 is a low power-consuming embedded Bluetooth module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated Bluetooth chip (TLSR8269) and a small number of peripheral circuits, with a built-in Bluetooth network communication protocol stack and robust library functions. TYBT8 also contains a 32-bit low power-consuming MCU, BLE/2.4G radio, 512 KB flash, 32 KB SRAM, and nine reusable I/O interfaces. Figure 1.1 shows the architecture of TYBT8.

1.1 Features

  • Built-in 32-bit low power-consuming MCU, which can also be used as an application processor Basic frequency: 48 MHz supported
  • Working voltage: 1.9 V to 3.6 V
  • Peripheral equipment: three PWMs
  • BLE RF

Compatible with BLE 4.2 RF data rate: up to 2 Mbit/s TX power: +7 dBm RX sensitivity: –92 dBm @ BLE 1 Mbit/s Built-in AES encryption for hardware External antenna Working temperature: -40℃ to 105℃

1.2 Major Application Fields

  • Intelligent LED
  • Intelligent home appliances
  • Intelligent low power-consuming sensors

2. Module Interfaces

2.1 Dimensions and Pin Layout

TYBT8 provides a total of six pins on the front and back sides for plug-in assembly.

TYBT8 size: 8.5 mm (W) x 12.5 mm (L) x 2.4 mm (H)

Figure 2.1 shows the overall pin layout of TYBT8.

Figure 2.1 Overall pin layout of TYBT8

2.2 Pin Definition

Table 2.1 describes the interface pins. Table 2.1 TYBT8 interface pins

No. Symbol I/O Type Functions
1 ANT I/O RF signal input and output port
2 GND P Module power supply reference ground pin
3 PWM0 I/O Common I/O interface, which can be used for PWM output of LED drives
4 PWM1 I/O Common I/O interface, which can be used for PWM output of LED drives
5 PWM4 I/O Common I/O interface, which can be used for PWM output of LED drives
6 3.3V P Module power supply input pin
TP1 SWS I/O Test point: Bluetooth chip programming pin
TP2 RST I Test point: Module reset pin
TP3 TX I/O Serial port sending pin, which can be used as a common I/O interface
TP4 RX I/O Serial port receiving pin, which can be used as a common I/O interface

Note: P indicates power-supply pins, and I/O indicates input/output pins. The SWS pin is used only for programming of module firmware.

3. Electrical Parameters

3.1 Absolute Electrical Parameters

Table 3.1 Absolute electrical parameters

Parameter Description Minimum Value Maximum Value Unit
Ts Storage temperature -20 125
VCC Power-supply voltage -0.3 3.9 V
Static electricity voltage (human model) TAMB -25℃ - 2 KV
Static electricity voltage (machine model) TAMB -25℃ - 0.5 KV

3.2 Electrical Conditions

Table 3.2 Normal electrical conditions

Parameter Description Minimum Value Typical Value Maximum Value Unit
Ta Working temperature -20 - 105
VCC Working voltage 1.9 3.3 3.6 V
VIL I/O low-level input -0.3 - VCC x 0.3 V
VIH I/O high-level input VCC x 0.7 - VCC V
VOL I/O low-level output VSS - 0.3 V
VOH I/O high-level output VCC - 0.3 - VCC V

3.3 Power Consumption in Operating Mode

Table 3.3 TX power consumption during constant emission

Symbol Condition Typical Value Unit
ITX Constant sending with 0 dBm output power 15 mA
IRX Constant receiving 12 mA
IDC Mesh connected 27 mA
Isleep Sleep mode with I/O waked up 10 uA
Ideepsleep Deep sleep mode 1.7 uA

4. RF Features

4.1 Basic RF Features

Table 4.1 Basic RF features

Parameter Description
Frequency band 2.4 GHz ISM band
Radio standard BLE 4.2
Data transmission rate 1 Mbit/s and 2 Mbit/s
Antenna type External antenna

4.2 RF Output Power

Table 4.2 TX power during constant emission

Parameter Minimum Value Typical Value Maximum Value Unit
RF average output power 3.8 7 8 dBm
20 dB modulation signal bandwidth (1 M) - 1300 - KHz
20 dB modulation signal bandwidth (2 M) - 2600 - KHz

4.3 RF RX Sensitivity

Table 4.3 RX sensitivity

Parameter Minimum Value Typical Value Maximum Value Unit
RX sensitivity 1Mbit/s -93 -92 -90 dBm
RX sensitivity 2Mbit/s -90 -89 -86 dBm
Frequency offset error 1Mbit/s -300 - +300 KHz
Frequency offset error 2Mbit/s -200 - +200 KHz
Co-channel interference suppression - - -7 - dB

5. Antenna Information

5.1 Antenna Types

TYBT8 uses an external spring antenna, and the specific gain and size can be customized according to customer requirements.

5.2 Antenna Interference Reduction

To ensure optimal RF performance, it is recommended that the antenna on the module be at least 15 mm away from other metal parts. If the antenna is wrapped with metal materials, the wireless signal will be significantly attenuated, thereby deteriorating the RF performance. Because the module is installed as a plug-in, reserve enough space for the antenna.

6. Packaging Information and Production Instructions

6.1 Mechanical Dimensions and Size of the Back Pad

Figure 6.1 TYBT8 size diagram

6.2 Production Instructions

Storage conditions of a delivered module are as follows:

  1. The anti-moisture bag must be placed in an environment where the temperature is under 30°C and the relative humidity is under 85%.
  2. The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.


  1. Throughout the production process, each involved operator must wear an electrostatic ring.
  2. During the operation, strictly protect the module from water and strains.

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