TYWE3S Module

WiFi module introduction–TYWE3S

1. Product Overview

TYWE3S is a low-power embedded Wi-Fi module developed by Hangzhou Tuya technology co., LTD. It consists of a highly integrated radio frequency chip ESP8266 and a handful of peripheral components, with a built-in Wi-Fi network protocol stack and rich library functions. TYWE3S is built in low-power 32-bit CPU, 2Mbyte flash memory, 50KB SRAM and rich peripheral resources.

TYWE3S is a RTOS platform that integrates all Wi-Fi MAC and TCP/IP protocol libraries. Users can develop embedded Wi-Fi products that meet their needs based on these developments.

The functional diagram of TYWE3S is shown in Figure 1:

TYWE1S结构图

1.1 Features

  • Built-in low-power 32-bit CPU, can be concurrently used as an application processor (main-frequency support 80MHz & 160MHz)
  • Built-in low-power 32-bit CPU can be concurrently used as an application processor (main-frequency support 80MHz and 160MHz)
  • Working voltage:3V-3.6V
  • Peripheral:9×GPIOs, 1×UART, 1×ADC
  • Wi-Fi connectivity
    • 802.11b/g/n
    • Channel 1-14@2.4GHz
    • Support WPA/WPA2 safe mode
    • 802.11b mode + 20dBm output power
    • Support STA/AP/STA+AP work mode
    • Support SmartConfig function(including Android & iOS devices)
    • Onboard PCB antenna
    • Working temperature:-20℃-85℃

1.2 Major application fields

  • Smart building
  • Smart home appliances, smart home
  • Smart plug. smart lighting
  • Industrial wireless control
  • Baby monitor
  • Webcam
  • Smart bus, etc

2. Dimensions and Footprint

2.1 Dimensions

TYWE3S has 2 rows of pins, lead pitch is 2mm.

TYWE3S size dimension:16±0.3mm (W)×24±0.3mm (L) ×3.4±0.2mm (H) 。 尺寸封装 Figure 2. TYWE3S front and back view

2.2 Definition of pin

引脚序号 符号 IO 类型 功能
1 RST I/O Hardware reset pin (low level effective, internal pull-up resistance)
2 ADC AI ADC port, 10-bit precision SAR ADC
3 EN I Module enable pin,normal use needs to receive 3.3V
4 GPIO16 I/O GPIO_16(Use 10K pull-up resistor for use)
5 GPIO14 I/O GPIO_14
6 GPIO12 I/O GPIO_12
7 GPIO13 I/O GPIO_13
8 VCC P Module Power Pin(3.3V)
9 GND P Power Reference Ground
10 GPIO15 O GPIO_15(Participate in the module power-on initialization process,use with caution)
11 GPIO2 O UART0_TXD(Used to print module internal information)
12 GPIO0 I/O GPIO5_0(Participate in the module power-on initialization process,use with caution)
13 GPIO4 I/O GPIO_04
14 GPIO5 I/O GPIO_05
15 RXD0 I/O UART0_RXD(2)
16 TXD0 O UART0_TXD(2) effective, internal pull-up resistance)

Instructions:

P indicates the power pin,I/O means input and output pins,AI represents the analog input pin.

RST is just a module hardware reset pin, can’t clear WiFi distribution network.

(1):This pin can only be used as an ADC port, can not be used as a normol IO port,need to be suspended when not in use。 When used ad an ADC input,input voltage range is limited to 0~1.0V

(2):UARTO is the user serial port,when the module is powered om, serial port has information output,user can ignore.

2.3 Definition of test point

Definition of test point pin is shown in the diagram as below.

Pin Number Symbol IO type Function
- TEST I For module production testing

Note: Test pins are not recommended.

3. Electrical Characteristics

3.1 Absolute Electrical Characteristics

Table 3,Absolute electrical characteristics

Parameters Description Minimum value Maximum value Unit
Ts Storage temperature -20 85
VCC Power supply voltage -0.3 3.6 V
Static electricity voltage (human model) TAMB-25℃ - 2 KV
Static electricity voltage (machine model) TAMB-25℃ - 0.5 KV

3.2 Electrical conditions

Table 4,Normal electrical conditions

Parameters Description Min Typ Max Unit
Ta Working temperature -20 - 85
VCC Working voltage 3.0 3.3 3.6 V
VIL I/O low-level input -0.3 - VCC*0.25 V
VIH I/O high-level input VCC*0.75 - VCC V
VOL I/O low-level output - - VCC*0.1 V
VOH I/O high-level output VCC*0.8 - VCC V
Imax I/O drive current - - 12 mA

​Table 4,Normal electrical conditions ​ ​

3.3 WI-Fi TX Power Consumption

​ Table 5 TX power consumption during constant emission

Parameter Mode Rate Tx power Typ Unit
IRF 11b 11 Mbit/s +17 dBm 220 mA
IRF 11g 54 Mbit/s +15 dBm 110 mA
IRF 11n MCS7 +13 dBm 100 mA

3.4 WI-Fi RX Power Consumption

​ Table 6 RX power consumption during constant emission

Parameter Mode Rate Typ Unit
IRF 11b 11 Mbit/s 76 mA
IRF 11g 54 Mbit/s 76 mA
IRF 11n MCS7 76 mA

3.5 Power Consumption in Operating Mode

​ Table 7 TYWE2L working current

Working Mode Working Status(Ta=25°C) Value Max Unit
EZ mode The module is in EZ status and the Wi-Fi indicator quickly flashes. 80 151 mA
AP mode The module is in AP status and the Wi-Fi indicator slowly flashes. 90 451 mA
Operation mode The module is in connected status and the Wi-Fi indicator is steady on. 58.5 411 mA
Disconnection mode The module is in disconnected status and the Wi-Fi indicator is steady off. 80 430 mA

4. RF Features

4.1 Basic RF Features

​ Table 8,Basic RF features

Parameter Description
Frequency band 2.412–2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n (channel 1–14)
Data transmitting rate 11b: 1, 2, 5.5, 11 (Mbit/s)11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbit/s)11n: HT20 MCS0–MCS7
Antenna type PCB antenna

4.2 WI-FI Output Power

​ Table 9 TX power during constant emission

Parameter Min Typ Max Unit
RF average output power, 802.11b CCK mode 1 M - 20 - dBm
RF average output power, 802.11g OFDM mode 54 M - 17 - dBm
RF average output power, 802.11n OFDM mode MCS7 - 14 - dBm
Frequency error -10 - 10 ppm

4.3 RF RX sensitivity

​ Table 10 RX Sensitivity

Parameter Min Typ Max Unit
PER < 8%, RX sensitivity, 802.11b CCK mode 1 M - -91 - dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode 54 M - -75 - dBm
PER < 10%, RX sensitivity, 802.11n OFDM mode MCS7 - -72 - dBm

5. Antenna Information

5.1 Antenna type

​ TYWE3S uses a MIFA onboard antenna with a PCB antenna of 2.4G WIFI band.

5.2 Antenna Interference Reduction

​To ensure optimal Wi-Fi performance, it is recommended that the antenna portion of the module be at least 15 mm away from other metal parts.

Since the use of TYWE3S is applied to the main control board and other components through the SMT process, the placement and placement of the PCB antenna directly affects the RF performance. Below are our recommended placements and suggested placements.

It is recommended to use the placement of scheme 1 and scheme 2, the antenna is hollowed out outside the frame or near the antenna, and the performance is basically consistent with the performance of the individual module RF test.

If the design must be limited, the PCB antenna must be placed on the backplane. Refer to the layout of the scheme 3. The antenna is in the frame, but there is no copper or trace near the antenna, but the RF performance will be somewhat lost. 2dBm.

It is not recommended to use the placement position of scheme 4. The antenna is in the frame and the copper or trace is placed under the antenna. The RF signal will be significantly attenuated.

6. Packaging Information and Poduction Instructions

6.1 Mechanical Dimensions

Note: PCB frame tolerance ±0.15 mm, PCB depth tolerance ±0.1 mm

6.2 Production Instructions

Storage conditions of a delivered module are as follows:

  1. The anti-moisture bag is placed in an environment where the temperature is under 30°C and the relative humidity is under 85%.
  2. The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

Precautions:

  1. Throughout the production process, each involved operator must wear an electrostatic ring.
  2. During the operation, strictly protect the module from water and strains.

400 Call

Consult

400-881-8611