Introduction to ZigBee Module--TYZS1
ZigBee module introduction–TYZS1
1. Product overview
TYZS1 is a low-power embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of one EFR32MG13P632 highly integrated wireless RF processor chip and a small number of peripheral devices. It has a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and rich library functions. The TYZS1 embeds a low-power 32-bit ARM Cortex-M4 core, 512KByte Flash program memory, 64KB RAM data memory, and a wealth of peripheral resources.
The TYZS1 is a FreeRTOS platform that gathers all Zigbee MAC and TCP/IP libraries into one place. It enables users to build on the product and develop embedded Zigbee products that suit their individual needs.
The TYZS1 schematic diagrama s shown：
A built-in low-power 32-bit ARM Cortex-M4 processor with a DSP instruction set and floating point unit that doubles as an application processor
- Supports main frequency of 40MHz
Wide operating voltage: 1.8V-3.8V
Peripherals: 9xGPIOs, 1xURT, 1xADC
Zigbee operating characteristics
- Supports 802.15.4 MAC/PHY
- Operating channels 11 to 26 @2.400-2.483GHz and an air-interface rate of 250Kbps
- A built-in DC-DC circuit for maximum power efficiency
- +10dBm maximum output
- 63uA/MHz operating power consumption; 1.4uA sleep current
- Active net pairing with terminal devices
- Built-in onboard PCB antenna/reserved Ipex connector for high gain external antenna
- Operating temperature: -40℃ to 85℃
- Supports hardware encryption, supports AES 128/256
1.2 Primary application fields
- Smart buildings
- Smart homes/appliances
- Smart plugs, smart lighting
- Industrial wireless control
- Health and measurements
- Asset tracking
2. Module interfaces
2.1 Package dimensions
The TYZS1 has 2 rows of pins with a 2mm gap.
TYZS1 dimensions: 16mm (W) x 24mm (L) x 3.5mm (H). The TYZS1’s dimensions are shown in Figure 2:
2.2 Pin definition
Interface pins are defined as shown in Table 1:
Table 1, TYZS1 interface pins description
|Pin number||Symbol||IO type||Function|
|1||nRST||I||Hardware reset pin, the chip is reset when the pin is LOW; The module comes with a power-on reset and the user can use this pin as needed|
|2||ADC||AI||ADC port (1), 12-bit precision SAR analog-to-digital converter|
|3||NC||-||NC pin, external handling is not required|
|4||GPIO0||I/O||GPIO pin usage.|
|5||SWO||I/O||GPIO pin usage/can be used as an output pin under JLINK communication.|
|6||PWM3||I/O||GPIO pin usage.|
|7||PWM1||I/O||GPIO pin usage.|
|8||VCC||P||Module power supply pin (common supply voltage : 3.3V）|
|9||GND||P||The reference ground of the module.|
|10||GPIO2||I/O||GPIO pin usage.|
|11||SWDIO||I/O||JLINK SWDIO programming pin. Can be used as a GPIO pin in normal applications.|
|12||SWCLK||I/O||JLINK SWCLK programming pin. Can be used as a GPIO pin in normal applications.|
|13||PWM2||I/O||GPIO pin usage.|
|14||GPIO3||I/O||GPIO pin usage.|
Description: P indicates the power pin, I/O indicates the input/output pin, and AI indicates analog input pin.
RST is only the module hardware reset pin; it cannot clear Zigbee net-pairing information.
(1) : This pin can only be used as an ADC port. It cannot be used as a normal IO port. If it is not used, it needs to be left floating. As an ADC input, the input voltage range is limited to 0-AVDD and can be configured by software.
2.2 Test point definition
Test pins are defined in Table 2:
Table 2, TYZS1 test pins description
|Pin number||Symbol||IO Type||Function|
|-||-||I||For module production testing|
Description: This test pin is not recommended for use.
3.1 Absolute electrical parameters
Table 3, Absolute parameters
|Parameters||Description||Minimum value||Maximum value||Unit|
|Electrostatic discharge voltage (human-body model)||TAMB-25℃||-||2.5||KV|
|Electrostatic discharge voltage (machine model)||TAMB-25℃||-||0.5||KV|
3.2 Operating conditions
Table 4, Normal operating conditions
|Parameters||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||IO low input||-0.3||-||VCC*0.25||V|
|VIH||IO high input||VCC*0.75||-||VCC||V|
|VOL||IO low output||-||-||VCC*0.1||V|
|VoH||IO high output||VCC*0.8||-||VCC||V|
|Imax||IO drive current||-||-||12||mA|
3.3 Zigbee TX power consumption
Table 5, Power consumption during continuous TX
|Symbol||Rate||Transmission power||Typical value||Unit|
Note: When testing the above data, continuous transmission duty cycle=100%.
3.4 the Zigbee RX power consumption
Table 6, RX continuous power
Note: When UART is active, the RX current is 14mA.
3.5 Power consumption when operating
Table 7, TYZS1 operating current
|Operation mode||Operating condition, Ta=25℃||Average value||Maximum value||Unit|
|Quick configuration||Module in quick configuration state||10||40||mA|
|Network connection state||Connected to a network||-||-||mA|
|Deep sleep mode||Deep sleep mode and retains 64KB Flash||1.4||3||uA|
4. RF Characteristics
4.1 Basic RF characteristics
Table 8, Basic RF characteristics
|Operating frequency||2.400 to 2.484GHz|
|Physical layer standard||IEEE 802.15.4|
|Data transfer rate||250Kbps|
|Antenna type||PCB antenna/Ipex connector external antenna|
|Line of sight||>120m|
4.2 Zigbee Output performance
Table 9, Continuous TX performance
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Output power adjustment step||-||0.5||1||dB|
|Output adjacent channel suppression||-31||dBc|
Note: If extended coverage is required, consider our TYZS3 module as the interface is stronger.The TYZS1 through wall
4.3 Zigbee RX sensitivity
Table 10, RX Sensitivity
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|PER<10%, RX sensitivity, 250Kbps@OQPSK||-||-102||-||dBm|
5. Antenna signal
5.1 Antenna type
The default PCB onboard antenna access/reserved Ipex connector is used to extend the high gain external antenna in complex installation environments.
5.2 Antenna interference reduction
To optimize Zigbee performance of the wireless module in combination with the PCB onboard antenna, it is recommended to keep the antenna at least 15mm from other metal parts. It is recommended that the corresponding antenna area of the adapter board be hollowed out for the best effect.
The user PCB board should not be routed around the antenna area and should not be covered with copper to avoid affecting the antenna radiation performance. For the module PCB onboard antenna area, refer to Figure 3 below, “TYZS1 mechanical dimensional drawing”.
6. Packaging information and production guidance
6.1 Mechanical dimensions
6.2 PCB recommended packaging
6.3 Production guide
The storage conditions for the module after it has been shipped are as follows:
- The moisture resistant bag must be stored at a temperature below 30℃, and under a relative humidity below 85%.
- The shelf life of dry packed products is six months following the packaged date.
- All line workers must wear anti-static wrist straps and anti-static clothing throughout the entire production process.
- It is strictly prohibited to allow a module to come into contact with water or other contaminants during operations.
6.4 Recommended furnace temperature curve