Zigbee Module Group Introduction — Tuya TYZS11 Zigbee
Zigbee Module Group Introduction — TYZS11
1. Product Overview
TYZS11 is a low power-consuming embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated wireless radio processor chip (EFR32MG13P732) and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions. TYZS11 is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512 KB flash, 64 KB RAM data memory, and robust peripheral resources. TYZS11 runs on the FreeRTOS platform that integrates all Zigbee MAC library functions. You can develop built-in Zigbee products as required. Figure 1 shows the architecture of TYZS11.
Figure 1 TYZS11 architecture
- Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions and floating-point unit functioning as an application processor Basic frequency: 40 MHz supported
- Wide working voltage: 1.8 V to 3.8 V
- Peripherals: 12 GPIOs, one UART, and one ADC
- Zigbee features 802.15.4 MAC/PHY supported Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s Built-in DC-DC circuit, maximizing the power-supply efficiency Maximum output power: +19 dBm; dynamic difference of output power: > 35 dB Power consumption when TYZS11 is working: 63 uA/MHz; current when TYZS11 is in the sleep state: 1.4 uA Proactive network configuration for terminals Copper column antenna and onboard PCB antenna Working temperature: -40°C to 85°C AES 128/256-based hardware encryption
1.2 Major Application Fields
- Intelligent building
- Intelligent home and household applications
- Intelligent socket and light
- Industrial wireless control
- Health care and measurement
- Asset tracing
2. Module Interfaces
2.1 Dimensions and Footprint
TYZS11 provides three rows of pins with the distance of 1.0 mm between every two pins.
TYZS11 dimension: 15.3 mm (W) x 22 mm (L) x 2 mm (H). Figure 2 shows the overall pin layout of TYZS11.
Figure 2 Front view of TYZS11
2.2 Pin Definition
Table 1 describes the interface pins. Table 1 TYZS11 interface pins
|1, 2, 11, 12, 13, and 17||GND||P||Module reference ground pins|
|19, 22, and 27|
|3||GPIO3||I/O||Corresponds to PD15 pin of the IC and functions as a GPIO.|
|4||PF3||I/O||PF3 pin of the IC and functions as a GPIO.|
|5||SWCLK||I/O||JLINK SWCLK programming pin, which can also be used as a GPIO in normal programs.|
|6||SWDIO||I/O||JLINK SWDIO programming pin, which can also be used as a GPIO in normal programs.|
|7||ADC||AI||ADC port 1, corresponding to PB11 pin of the IC. ADC is a 12-bit precision SAR analog-to-digital converter.|
|8 and 18||3.3 V||P||Power-supply pins of TYZS11 (typical power-supply voltage: 3.3 V)|
|9||SWO||I/O||Corresponds to PF2 pin of the IC and functions as a GPIO. It can be used as an output pin when J-Link is used.|
|10||PF6||I/O||Corresponds to PF6 pin of the IC and functions as a GPIO.|
|14||UART_TXD||O||UART0_TXD communication interface, corresponding to PA0 pin of the IC.|
|15||UART_RXD||I||UART0_RXD communication interface, corresponding to PA1 pin of the IC.|
|16||PD14||I/O||Corresponds to PD14 pin of the IC and functions as a GPIO.|
|20||PWM3||I/O||Corresponds to PF4 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO.|
|21||PWM2||I/O||Corresponds to PA2 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO.|
|23||nRST||I||Hardware reset pin, and the chip is reset when the level is low. TYZS11 has a power-on reset function, and this pin is not necessary in the actual situation.|
|24||GPIO2||I/O||Corresponds to PA5 pin of the IC and functions as a GPIO.|
|25||GPIO0||I/O||Corresponds to PA3 pin of the IC and functions as a GPIO.|
|26||PWM1||I/O||Corresponds to PF5 pin of the IC and functions as a light drive interface. It can also be configured as a GPIO.|
Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
nRST is only a module hardware reset pin, which cannot clear the Zigbee network configuration.
This pin can only be used as the ADC interface and cannot be used as the common I/O pin. If this pin is not used, it must be disconnected. When this pin is used as the ADC input interface, the input voltage range must be 0–AVDD, which can be configured using software.
2.3 Test Pin Definition
Table 2 describes the test pins. Table 2 TYZS11 test pins
|-||-||I||Used for the module production test.|
Note: It is recommended that test pins not be used.
3. Electrical Characteristics
3.1 Absolute Electrical Characteristics
Table 3Absolute electrical characteristics
|Parameter||Description||Minimum Value||Maximum Value||Unit|
|Static electricity voltage (human model)||TAMB -25°C||-||2.5||kV|
|Static electricity voltage (machine model)||TAMB -25°C||-||0.5||kV|
3.2 Electrical Conditions
Table 4 Normal electrical conditions
|Parameter||Description||Minimum Value||Typical Value||Maximum Value||Unit|
|VIL||I/O low-level input||-0.3||-||VCC x 0.25||V|
|VIH||I/O high-level input||VCC x 0.75||-||VCC||V|
|VOL||I/O low-level output||-||-||VCC x 0.1||V|
|VOH||I/O high-level output||VCC x 0.8||-||VCC||V|
|Imax||I/O drive current||-||-||12||mA|
3.3 Zigbee TX Power Consumption
Table 5 TX power consumption during constant emission
|Symbol||Rate||TX power||Typical Value||Unit|
|IRF||250 kbit/s||+19 dBm||120||mA|
|IRF||250 kbit/s||+13 dBm||50||mA|
|IRF||250 kbit/s||+10 dBm||32||mA|
|IRF||250 kbit/s||+4 dBm||17||mA|
|IRF||250 kbit/s||+1 dBm||11.8||mA|
Note: When the preceding data is being tested, the duty cycle is set to 100%.
3.4 Zigbee RX Power Consumption
Table 6 RX power consumption during constant receiving
Note: When the UART is in the active state, the received current is 14 mA.
3.5 Power Consumption in Operating Mode
Table 7 TYZS11 working current
|Working Mode||Working Status (Ta = 25°C)||Average Value||Maximum Value||Unit|
|EZ mode||The module is in the EZ state.||10||40||mA|
|Operation mode||The module is in the connected state.||3||5||mA|
|Deep sleep mode||The module is in the deep sleep mode, with the 64 KB flash.||1.4||3||uA|
4. RF Features
4.1 Basic RF Features
Table 8 Basic RF features
|Frequency band||2.400 GHz to 2.484 GHz|
|Physical-layer standard||IEEE 802.15.4|
|Data transmitting rate||250 kbit/s|
|Antenna type||External copper column spring antenna and onboard PCB antenna|
|Line-of-sight transmission distance||> 120 m|
4.2 Zigbee Output Performance
Table 9 TX continuous transmission performance
|Parameter||Minimum Value||Typical Value||Maximum Value||Unit|
|Maximum output power||-||+19||-||dBm|
|Minimum output power||-||-30||-||dBm|
|Output power adjustment step||-||0.5||1||dB|
|Output spectrum adjacent-channel rejection ratio||-31||dBc|
Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.
4.3 Zigbee RX Sensitivity
Table 10 RX sensitivity
|Parameter||Minimum Value||Typical Value||Maximum Value||Unit|
|PER < 10%, RX sensitivity, 250 kbit/s@OQPSK||-||-102||-||dBm|
5. Antenna Information
5.1 Antenna Types
By default, the onboard PCB antenna is used. It can be connected to an external copper spring antenna using a connector, which is used for wireless extended coverage in complex installation conditions.
5.2 Antenna Interference Reduction
When you use a copper column antenna on a Zigbee module, make sure that the antenna on the module is at least 15 mm away from other metal parts to ensure optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.
To prevent negative effect on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.
6. Packaging Information and Production Instructions
6.1 Mechanical Dimensions
Figure 3 Mechanical dimensions of TYZS11
6.2 Recommended PCB Encapsulation
Figure 4 TYZS11 schematic diagram and pin connection
Comply with the encapsulation diagram provided in Figure 5. Figure 5 Encapsulation diagram of TYZS11
6.3 Production Instructions
The factory storage conditions are as follows:
1.The anti-moisture bag must be stored in an environment with a temperature of less than 30° C and humidity of less than 85% RH.
2.The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed. Note: 1.During the whole process of production, the operator of each station must wear an electrostatic ring and electrostatic clothing. 2.During the operation, strictly protect the module from water and strains.
6.4 Recommended Oven Temperature Profile