ZigBee Module Group Introduction — TYZS13

ZigBee Module Group Introduction — TYZS13

1. Product Overview

TYZS13 is a low power-consuming embedded ZigBee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of the highly integrated wireless radio processor chip, EFR32MG13P732, and several peripherals, with a built-in 802.15.4 PHY/MAC ZigBee network protocol stack and robust library functions. TYZS13 is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512 KB flash, 64 KB RAM data memory, and robust peripheral resources. TYZS13 runs on the FreeRTOS platform that integrates all ZigBee MAC library functions. You can develop built-in ZigBee products as required. Figure 1 shows the architecture of TYZS13.

1.1 Features

  • Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions and floating-point unit functioning as an application processor Basic frequency: 40 MHz
  • Wide working voltage range: 1.8 V to 3.8 V
  • Peripherals: 22 GPIOs, 1 UART, and 1 ADC
  • ZigBee features Working channel: channels 11 to 26 on 2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s Built-in DC-DC circuit, maximizing the power supply efficiency Maximum output power: +19 dBm; dynamic difference of output power: > 35 dB Power consumption when TYZS13 is working: 63 μA/MHz; current when TYZS13 is in sleep mode: 1.4 μA Proactive network configuration for terminals Cooper antenna/External high-gain antenna used with the I-PEX connector Working temperature: –40℃ to +85℃ AES 128/256-based hardware encryption

1.2 Major Application Fields

  • Smart building
  • Smart home and household applications
  • Smart socket and lighting
  • Industrial wireless control
  • Health care and measurement
  • Asset tracing

2. Module Interfaces

2.1 Dimensions and Footprint

TYZS13 provides three rows of pins with the pin pitch of 1.27 mm.

Dimensions of TYZS13 are as follows: 15 mm (W) x 18 mm (L) x 2 mm (H). Figure 2 shows the overall pin layout of TYZS13.

2.2 Pin Definition

Table 1 describes the interface pins. Table 1 TYZS13 interface pins

Pin No. Symbol I/O Type Functions
1 GND P Module reference ground pin
2 PD13 I/O GPIO, corresponding to the PD13 pin (pin 22) of the IC
3 PD12 I/O GPIO, corresponding to the PD12 pin (pin 21) of the IC
4 PD11 I/O GPIO, corresponding to the PD11 pin (pin 20) of the IC
5 GPIO0 I/O GPIO, corresponding to the PA3 pin (pin 28) of the IC
6 GPIO2 I/O GPIO, corresponding to the PA5 pin (pin 30) of the IC
7 GPIO3 I/O GPIO, corresponding to the PD15 pin (pin 2) of the IC
8 PC11 I/O GPIO, corresponding to the PC11 pin (pin 48) of the IC
9 PC10 I/O GPIO, corresponding to the PC10 pin (pin 47) of the IC
10 PB12 I/O GPIO, corresponding to the PB12 pin (pin 32) of the IC
11 PF6 I/O GPIO, corresponding to the PF6 pin (pin 7) of the IC
12 ADC AI Interface 1 of the ADC (a 12-bit precision SAR analog-to-digital converter), corresponding to the PB11 pin of the IC
13 PB15 I/O GPIO, corresponding to the PB15 pin (pin 36) of the IC
14 PB13 I/O GPIO, corresponding to the PB13 pin (pin 33) of the IC
15 nRST I Hardware reset pin, and the chip is reset when the level is low. TYZS13 has a power-on reset function, and this pin may be unnecessary in the actual situation.
16 TXD O UART0_TXD
17 RXD I UART0_RXD
18 SWCL K I/O JLINK SWCLK programming pin, which can also be used as a GPIO in common programs
19 SWDI O I/O JLINK SWDIO programming pin, which can also be used as a GPIO in common programs
20 PF3 I/O GPIO, corresponding to the PF3 pin (pin 4) of the IC
21 PC7 I/O GPIO, corresponding to the PC7 pin (pin 44) of the IC
22 PC8 I/O GPIO, corresponding to the PC8 pin (pin 45) of the IC
23 PC9 I/O GPIO, corresponding to the PC9 pin (pin 46) of the IC
24 SWO I/O Used as a GPIO or an output pin in the JLINK communication state; corresponding to the PF2 pin of the IC when being used as a GPIO
25 PWM3 I/O GPIO, corresponding to the PF4 pin of the IC; light drive PWM interface
26 PWM2 I/O GPIO, corresponding to the PA2 pin of the IC; light drive PWM interface
27 PWM1 I/O GPIO, corresponding to the PA2 pin of the IC; light drive PWM interface
28 GND P Module reference ground pin
29 3.3 V P Power-supply pin of TYZS13 (typical power supply voltage: 3.3 V)
30 3.3 V P Power-supply pin of TYZS13 (typical power supply voltage: 3.3 V)

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins. nRST is only a module hardware reset pin, which cannot be used to clear the ZigBee network configuration. nRST can be used only as an ADC port and not a common I/O port. When not being used, nRST must be disconnected. When nRST is used as an ADC input port, the input voltage range is 0 V to the AVdd which is configurable using software.

2.3 Test Pin Definition

Table 2 describes the test pins. Table 2 TYZS13 test pin

Pin No. Symbol I/O Type Functions
N/A N/A I Used for the module production test

Note: You are not advised to use the test pin.

3. Electrical Characteristics

3.1 Absolute Electrical Characteristics

Table 3 Absolute electrical characteristics

Parameter Description Minimum Value Maximum Value Unit
Ts Storage temperature –50 +150 °C
VCC Power-supply voltage –0.3 3.8 V
Static electricity voltage (human model) Tamb –25°C N/A 2.5 kV
Static electricity voltage (machine model) Tamb –25°C N/A 0.5 kV

3.2 Electrical Conditions

Table 4 Normal electrical conditions

Parameter Description Minimum Value Typical Value Maximum Value Unit
Ta Working temperature –40 N/A +85 °C
VCC Working voltage 1.8 3.3 3.8 V
VIL I/O low-level input –0.3 N/A VCC x 0.25 V
VIH I/O high-level input VCC x 0.75 N/A VCC V
VOL I/O low-level output N/A N/A VCC x 0.1 V
VOH I/O high-level output VCC x 0.8 N/A VCC V
Imax I/O drive current N/A N/A 12 mA

3.3 Zigbee TX Power Consumption

Table 5 TX power consumption during constant emission

Symbol Rate TX power Typical Value Unit
IRF 250 kbit/s +19 dBm 120 mA
IRF 250 kbit/s +13 dBm 50 mA
IRF 250 kbit/s +10 dBm 32 mA
IRF 250 kbit/s +4 dBm 17 mA
IRF 250 kbit/s +1 dBm 11.8 mA

Note: When the preceding data is being tested, the duty cycle is set to 100%.

3.4 Zigbee RX Power Consumption

Table 6 RX power consumption during constant receiving

Symbol Rate Typical Value Unit
IRF 250 kbit/s 8 mA

Note: When the UART is in the active state, the received current is 14 mA.

3.5 Power Consumption in Operating Mode

Table 7 TYZS13 working current

Working Mode Working Status (Ta = 25°C) Average Value Maximum Value Unit
EZ mode The module is in the EZ state. 10 40 mA
Operation mode The module is connected to the network. 3 5 mA
Deep sleep mode The module is in the deep sleep mode, with the 64 KB flash. 1.4 3 μA

4. RF Features

4.1 Basic RF Features

Table 8 Basic RF features

Parameter Description
Frequency band 2.400 GHz to 2.484 GHz
Physical-layer standard IEEE 802.15.4
Data transmitting rate 250 kbit/s
Antenna type Cooper antenna/External antenna used with the I-PEX connector
Line-of-sight transmission distance > 120 m

4.2 Zigbee Output Performance

Table 9 TX continuous transmission performance

Parameter Minimum Value Typical Value Maximum Value Unit
Maximum output power N/A +19 N/A dBm
Minimum output power N/A –30 N/A dBm
Output power adjustment step N/A 0.5 1 dB
Frequency error –15 N/A +15 ppm
Output spectrum adjacent-channel rejection ratio –31 dBc

Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.

4.3 Zigbee RX Sensitivity

Table 10 RX sensitivity

Parameter Minimum Value Typical Value Maximum Value Unit
PER < 10%, RX sensitivity, 250 kbit/s (OQPSK) N/A –101 N/A dBm

5. Antenna Information

5.1 Antenna Types

By default, the copper column antenna is used. In addition, external antennas can be connected through I-PEX connectors, which is applied to extend the coverage in complex installation environments.

5.2 Antenna Interference Reduction

When you use a copper column antenna on a ZigBee module, ensure that the antenna on the module is at least 15 mm away from other metal parts for optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out. To prevent negative impact on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.

6. Packaging Information and Production Instructions

6.1 Mechanical Dimensions

6.3 Production Instructions

Storage conditions of a delivered module are as follows:

1.The anti-moisture bag must be stored in an environment with the temperature and humidity lower than 30° C and 85% RH, respectively. 2.The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

Note: 1.During the whole process of production, all operators must wear the electrostatic ring and electrostatic clothing. 2.During operations, strictly protect the module from water and strains.

400 Call

Consult

400-881-8611