Tuya TYZS1L ZigBee Module

1. Product Overview

TYZS1L is a low power-consuming embedded ZigBee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated wireless radio processor chip (EFR32MG13P732IM48-C) and several peripherals, with a built-in 802.15.4 PHY/MAC ZigBee network protocol stack and robust library functions. TYZS1L is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512 KB flash, 64 KB RAM data memory, and robust peripheral resources. TYZS1L is a FreeRTOS platform that integrates all the function libraries of the ZigBee MAC and TCP/IP protocols. You can develop built-in ZigBee products as required. Figure 1 shows the architecture of TYZS1L. Figure 1 TYZS1L architecture

1.1 Features

  • Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions and floating-point unit functioning as an application processor Basic frequency: 40 MHz supported

  • Wide working voltage: 1.8 V to 3.8 V

  • Peripherals: nine GPIOs, one UART, and one ADC

  • White ink, black silk screen, patch or plug-in

  • ZigBee operating feature 802.15.4 MAC/PHY supported

    Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s

    Built-in DC-DC circuit, maximizing the power supply efficiency

    Maximum output power: +19 dBm; dynamic difference of output power: > 35 dB

    Power consumption when TYZS1L is working: 63 μA/MHz; current when TYZS1L is in sleep mode: 1.4 μA

    Proactive network configuration for terminals

    Built-in onboard PCB antenna/External high-gain antenna used with the I-PEX connector

    Working temperature: -40°C to +125°C

    AES 128/256-based hardware encryption

1.2 Major Application Fields

  • Intelligent building

  • Intelligent home and household applications

  • Intelligent socket and smart lighting

  • Industrial wireless control

  • Healthcare and measurement

  • Asset tracing

2. Module Interfaces

2.1 Dimensions and Pin Layout

TYZS1L provides two rows of pins with the distance of 2 mm between every two pins. TYZS1L dimension: 16 mm (W) x 24 mm (L) x 3.5 mm (H). Figure 2 shows the overall pin layout of TYZS1L. Figure 2 Front and back views of TYZS1L

2.2 Pin Definition

Table 1 describes the interface pins. Table 1 TYZS1L interface pins

引脚序号 符号 IO 类 型 功能
1 nRST I Hardware reset pin. The chip is reset when the level is low. TYZS1L has a power-on reset function, and this pin is not necessary in the actual situation.
2 ADC AI Interface 1 of the ADC (a 12-bit precision SAR analog-to-digital converter), corresponding to the PB11 pin of the IC.
3 NC - NC pin. External processing is not required.
4 GPIO0 I/O Functions as a GPIO, corresponding to the PA3 pin of the IC.
5 SWO I/O Functions as a GPIO or an output pin in the JLINK communication state, corresponding to the PF2 pin of the IC.
6 PWM3 I/O Functions as a GPIO, corresponding to the PF4 pin of the internal IC.
7 PWM1 I/O Functions as a GPIO, corresponding to the PF5 pin of the internal IC.
8 VCC P Power-supply pin of TYZS1L (typical power-supply voltage : 3.3 V).
9 GND P Module reference ground pin.
10 GPIO2 I/O Functions as a GPIO, corresponding to the PA5 pin of the IC.
11 SWDI I/O JLINK SWDIO programming pin. It can also be used as a GPIO in common programs, corresponding to the PF1 pin of the IC.
12 SWCL K I/O JLINK SWCLK programming pin. It can also be used as a GPIO in common programs, corresponding to the PF0 pin of the IC.
13 PWM2 I/O Functions as a GPIO, corresponding to the PA2 pin of the IC.
14 GPIO3 I/O Functions as a GPIO, corresponding to the PD15 pin of the IC.
15 RXD I/O UART0_RXD pin, corresponding to the PA1 pin of the IC.
16 TXD O UART0_TXD pin, corresponding to the PA0 pin of the IC.

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins. nRST is only a module hardware reset pin, which cannot clear the ZigBee network configuration. (1): This pin can only be used as an ADC interface and cannot be used as a common I/O pin. If this pin is not used, it must be disconnected. When this pin is used as the ADC input interface, the input voltage range must be 0–AVDD, which can be configured using software.

2.3 Test Pin Definition

Table 2 describes the test pins. Table 2 TYZS1L test pins

No. Symbol I/O Type Functions
- - I Used for the module production test.

Note: It is recommended that test pins not be used.

3. Electrical Parameters

3.1 Absolute Electrical Parameters

Table 3 Absolute electrical parameters

Parameter Description Minimum Value Maximum Value Unit
Ts Storage temperature -50 150 °C
VCC Power-supply voltage -0.3 3.8 V
Static electricity voltage (human model) TAMB -25°C - 2.5 kV
Static electricity voltage (machine model) TAMB -25°C - 0.5 kV

3.2 Electrical Conditions

Table 4 Normal electrical conditions

Parameter Description Minimum Value Typical Value Maximum Value Unit
Ta Working temperature -40 - 125 °C
VCC Working voltage 1.8 3.3 3.8 V
VIL I/O low-level input -0.3 - VCC x 0.25 V
VIH I/O high-level input VCC x 0.75 - VCC V
VOL I/O low-level output - - VCC x 0.1 V
VOH I/O high-level output VCC x 0.8 - VCC V
Imax I/O drive current - - 12 mA

3.3 ZigBee TX Power Consumption

Table 5 TX power consumption during constant emission

Symbol Rate Transmit Power Typical Value Unit
IRF 250Kbps +19dBm 120 mA
IRF 250Kbps +13dBm 50 mA
IRF 250Kbps +10dBm 32 mA
IRF 250Kbps +4dBm 17 mA
IRF 250Kbps +1dBm 11.8 mA

Note: When the preceding data is being tested, the duty cycle is set to 100%.

3.4 ZigBee RX Power Consumption

Table 6 RX power consumption during constant receiving

Symbol Rate Typical Value Unit
IRF 250Kbps 8 mA

Note: When the UART is in the active state, the received current is 14 mA.

3.5 Power Consumption in Working Mode

Table 7 TYZS1L working current

Working Mode Working Status (Ta = 25°C) Average Value Maximum Value Unit
EZ mode The module is in the EZ state. 10 40 mA
Operation mode The module is in the connected state. 3 5 mA
Deep sleep mode The module is in the deep sleep mode, with the 64 KB flash. 1.4 3 μA

4. RF Features

4.1 Basic RF Features

Table 8 Basic RF features

Parameter Description
Frequency band 2.400 GHz to 2.483 GHz
Physical layer standard IEEE 802.15.4
Data transmission rate 250 kbit/s
Antenna type PCB antenna/External antenna used with the I-PEX connector
Line-of-sight transmission distance > 150 m

4.2 ZigBee Output Performance

Table 9 TX continuous transmission performance

Parameter Minimum Value Typical Value Maximum Value Unit
Maximum output power - +19 - dBm
Minimum output power - -30 - dBm
Output power adjustment step - 0.5 1 dB
Frequency error -15 - +15 ppm
Output spectrum adjacent-channel rejection ratio -31 dBc

Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.

4.3 ZigBee RX Sensitivity

Table 10 RX sensitivity

Parameter Minimum Value Typical Value Maximum Value Unit
PER < 10%, RX sensitivity, 250 kbit/s@OQPSK - -101 - dBm

5. Antenna Information

5.1 Antenna Types

By default, the onboard PCB antenna is used. In addition, external antennas can be connected through I-PEX connectors, which are applied to extend the coverage in complex installation environments.

5.2 Antenna Interference Reduction

When you use an onboard PCB antenna on a ZigBee module, make sure that the antenna on the module is at least 15 mm away from other metal parts to ensure optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out. To prevent negative effect on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board. For details about the area of the onboard PCB antenna on a module, see Figure 3.

6. Packaging Information and Production Instructions

6.1 Mechanical Dimensions

Figure 3 Mechanical dimensions of TYZS1L

Figure 4 TYZS1L diagram with pins

Figure 5 PCB encapsulation diagram of TYZS1L

6.3 Production Instructions

Storage conditions of a delivered module are as follows:

  1. The anti-moisture bag must be placed in an environment where the temperature is under 30°C and the relative humidity is under 85%.
  2. The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.


  1. Throughout the production process, each involved operator must wear an electrostatic ring and electrostatic clothes.
  2. During the operation, strictly protect the module from water and strains.

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