Introduction to ZigBee Module--TYZS3

ZigBee module introduction–TYZS3

1. Product overview

​ The TYZS3 is a low-power, embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. The module consists of a EFR32MG13P732 highly integrated wireless RF processor chip and a small number of peripheral devices. It has a built-in 802.15.4 PHY/MAC Zigbee network protocol and a large number of library functions. The TYZS3 embeds a low-power 32-bit ARM Cortex-M4 core, 512KByte Flash program memory, 64KB RAM data memory, and a wealth of peripheral resources.

​ The TYZS3 is a FreeRTOS platform that gathers all Zigbee MAC and TCP/IP libraries into one place. It enables users to build on the product and develop embedded Zigbee products that suit their individual needs.

​ The TYZS3 schematic diagram as shown in Figure 1:

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1.1 Features

A built-in low-power 32-bit ARM Cortex-M4 processor with a DSP instruction set and a floating point unit that doubles as an application processor

  • Supports a main frequency of 40MHz

Wide operating voltage: 1.8V-3.8V

Peripherals: 9×GPIOs, 1×UART, 1×ADC

Zigbee operating characteristics

  • Supports 802.15.4 MAC/PHY
  • Operating channels 11 to 26 @2.400-2.483GHz, air-interface rate 250Kbps
  • Built-in DC-DC circuit for maximum power efficiency
  • +19dBm maximum output, dynamic power output > 35dB
  • 63uA/MHz operating power consumption; 1.4 uA sleep current
  • Active net pairing with terminal devices
  • Built-in onboard PCB antenna/reserved Ipex connector for high gain external antenna
  • Operating temperature: -40℃ to 85℃
  • Supports hardware encryption and supports AES 128/256

1.2 Primary application fields

  • Smart buildings
  • Smart homes/appliances
  • Smart plugs, smart lighting
  • Industrial wireless control
  • Health and measurements
  • Asset tracking

2. Module interfaces

2.1 Package dimensions

​ The TYZS3 has 2 rows of pins with a 2mm gap.

​ TYZS3 dimensions: 16mm (W) x 24mm (L) x 3.5mm (H). The TYZS3’s dimensions are shown in Figure 2:

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2.2. Pin definition

​ Interface pins are defined as shown in Table 1:

​ Table 1, TYZS3 interface pins description

Pin number Symbol IO Type Function
1 nRST I Hardware reset pin, the chip is reset when the pin is LOW; Power-on reset of the module, the user can use this pin as needed
2 ADC AI ADC![img](file:///C:\Users\hyper\AppData\Local\Temp\ksohtml\wpsB14E.tmp.png), 12-bit precision SAR analog to digital converter
3 NC - NC pin, external handling is not required
4 GPIO0 I/O GPIO pin usage.
5 SWO I/O GPIO pin usage/can be used as an output pin under JLINK communication.
6 PWM3 I/O GPIO pin usage.
7 PWM1 I/O GPIO pin usage.
8 VCC P Module power supply pin (common supply voltage: 3.3V)
9 GND P The reference ground of the module.
10 GPIO2 I/O GPIO pin usage.
11 SWDIO I/O JLINK SWDIO programming pin. Can be used as a GPIO pin in normal applications.
12 SWCLK I/O JLINK SWCLK programming pin. Can be used as a GPIO pin in normal applications.
13 PWM2 I/O GPIO pin usage.
14 GPIO3 I/O GPIO pin usage.
15 RXD I/O UART0_RXD
16 TXD O UART0_TXD

Description: P indicates the power pin; I/O indicates the input/output pin; AI indicates analog input pin.

​ nRST is only the module hardware reset pin; it cannot clear Zigbee net-pairing information.

​ (1): This pin can only be used as an ADC port. It cannot be used as a normal IO port. If it is not used, it needs to be left floating.

​ As an ADC input, the input voltage range is limited to 0-AVDD and can be configured by software.

2.3 Test point definition

​ Test pins are defined in Table 2:

​ Table 2, TYZS3 test pins description

Pin number Symbol IO Type Function
- - I For module production testing

Description: This test pin is not recommended for use.

3. Electrical parameters

3.1 Absolute electrical parameters

​ Table 3, Absolute parameters

Parameters Description Minimum value Maximum value Unit
Ts Storage temperature -50 150
VCC Input voltage -0.3 3.8 V
Electrostatic discharge voltage (human-body model) TAMB-25℃ - 2.5 KV
Electrostatic discharge voltage (machine model) TAMB-25℃ - 0.5 KV

3.2. Operating conditions

​ Table 4, Normal operating conditions

Parameters Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 85
VCC Operating voltage 1.8 3.3 3.8 V
VIL IO low input -0.3 - VCC*0.25 V
VIH IO high input VCC*0.75 - VCC V
VOL IO low output - - VCC*0.1 V
VOH IO high output VCC*0.8 - VCC V
Imax IO drive current - - 12 mA

3.3 Zigbee TX power consumption

​ Table 5, Power consumption during continuous TX

Symbol Rate Transmission power Typical value Unit
IRF 250Kbps +19dBm 120 mA
IRF 250Kbps +13dBm 50 mA
IRF 250Kbps +10dBm 32 mA
IRF 250Kbps +4dBm 17 mA
IRF 250Kbps +1dBm 11.8 mA

Note: When testing the above data, the continuous transmission duty cycle=100%.

3.4 Zigbee RX power consumption

​ Table 6, Power consumption during continuous RX

Symbol Rate Typical value Unit
IRF 250Kbps 8 mA

Note: When UART is active, the RX current is 14mA.

3.5 Power consumption in operating mode

​ Table 7, TYZS3 operating current

Operation mode Operating condition, Ta=25℃ Average value Maximum value Unit
Quick configuration Module in quick configuration state 10 40 mA
Network connection state Connected to a network - - mA
Deep sleep mode Deep sleep mode and retains 64KB Flash 1.4 3 uA

4. RF Characteristics

4.1 Basic RF characteristics

​ Table 8, Basic RF characteristics

Parameter Description
Operating frequency 2.400 to 2.484GHz
Physical layer standard IEEE 802.15.4
Data transfer rate 250Kbps
Antenna type PCB antenna/Ipex connector external antenna
Line of sight >150m

4.2 Zigbee Output performance

​ Table 9, ContinuousTX performance

Parameter Minimum value Typical value Maximum value Unit
Maximum output - +19 - dBm
Minimum output - -30 - dBm
Output power adjustment step - 0.5 1 dB
Frequency error -15 - +15 ppm
Output adjacent channel suppression -31 dBc

Note: The maximum output power is +19dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmissions in extremely complex environments, such as modules embedded in the wall.

4.3 Zigbee RX sensitivity

​ Table 10, RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<10%, RX sensitivity, 250Kbps@OQPSK - -102 - dBm

5. Antenna signal

5.1 Antenna type

​ Default PCB onboard antenna connection. At the same time, an external antenna can be connected via the Ipex connector for extended coverage in complex installation environments.

5.2 Antenna interference reduction

​ To optimize Zigbee performance of the wireless module in combination with the PCB onboard antenna, it is recommended to keep the antenna at least 15mm from other metal parts. It is recommended that the corresponding antenna area of the adapter board be hollowed out for the best effect.

​ The user PCB board should not be routed around the antenna area and should not be covered with copper to avoid affecting the antenna radiation performance.

​ For the module PCB onboard antenna area, refer to Figure 3 “TYZS3 mechanical dimensional drawing” below.

6. Packaging information and production guidance

6.1 Mechanical dimensions

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6.3 Production guide

​ The storage conditions for the module after it has been shipped are as follows:

​ 1. The moisture resistant bag must be stored at a temperature below 30℃, and under a relative humidity below 85%.

​ 2. The shelf life of dry packed products is 6 months following the packaged date.

​ Important information

​ 1. All line workers must wear anti-static wrist straps and anti-static clothing throughout the entire production process.

​ 2. It is strictly prohibited to allow a module to come into contact with water or other contaminants during operations.

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