Introduction to ZigBee Module--TYZS6
ZigBee module introduction–TYZS6
1. Product Overview
The TYZS6 is a low-power, embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of one EFR32MG1B132 highly integrated wireless RF processor chip and a small number of peripheral devices. It has a built-in 802.15.4 PHY/MAC Zigbee network protocol and a large number of library functions. The TYZS6 embeds a low-power 32-bit ARM Cortex-M4 core, 256KByte Flash program memory, 32KB RAM data memory, and a wealth of peripheral resources. TYZS6 is a FreeRTOS platform that gathers all Zigbee MAC and TCP/IP libraries into one place. It enables users to build on the product and develop embedded Zigbee products that suit their individual needs. The TYZS6 schematic diagram as shown：
A built-in low-power 32-bit ARM Cortex-M4 processor with a DSP instruction set and floating point unit that doubles as an application processor
- Supports main frequency of 40MHz
Wide operating voltage: 1.8V-3.8V
Peripherals: 5xGPIOs, 1xURT, 1xADC
Zigbee operating characteristics
Supports 802.15.4 MAC/PHY
Operating channels 11 to 26 @2.400-2.483GHz and an air-interface rate of 250Kbps
A built-in DC-DC circuit for maximum power efficiency and +10dBm maximum output.
63uA/MHz operating power consumption; 3uA sleep current
Active net pairing with terminal devices
Built-in PCB onboard antenna
Operating temperature: -40℃ to 85℃
Supports hardware encryption, supports AES 128/256
1.2 Primary application fields
- Smart buildings
- Smart homes/appliances
- Smart plugs, smart lighting
- Industrial wireless control
- Health and measurements
- Asset tracking
2. Module Interfaces
2.1 Package dimensions
The TYZS6 has 2 pins on the front and rear with a 2mm gap and a total of 11 external pins.
TYZS6 dimensions: 17.95mm (L) x 15.00mm (W) x 2.0mm (H). The TYZS6 dimensions, as shown in Figure 2:
2.2 Pin definition
Interface pins are defined as shown in Table 1:
Table 1, TYZS6 interface pins and TP arrangement
|1||3.3V||P||Module power supply pin (common supply voltage: 3.3V)|
|2||PWM1||I/O||Light driver port/ GPIO pin usage.|
|3||GND||P||The reference ground of the module.|
|4||PWM3||I/O||Light driver port/ GPIO pin usage.|
|8||ADC||I/O||ADC analog input.|
|10||nRST||I||Hardware reset pin, the chip is reset when the pin is LOW; The module comes with a power-on reset, the user can use this pin as needed|
|TP1||Test point||SWCLK||JLINK SWCLK programming pin. Can be used as a GPIO pin in normal applications.|
|TP2||Test point||SWDIO||JLINK SWCLK programming pin. Can be used as a GPIO pin in normal applications.|
|TP3||Test point||SWO||JLINK SWO output pin, can be used as GPIO port in normar applications.|
Description: P indicates the power pin, I/O indicates the input/output pin, and AI indicates the analog input pin. RST is only the module hardware reset pin; it cannot clear Zigbee net-pairing information. (1): This pin can only be used as an ADC port. It cannot be used as a normal IO port. If it is not used, it needs to be left floating. As an ADC input, the input voltage range is limited to 0-AVDD and can be configured by software.
2.3 Test point definition
|-||TEST||I||For module production testing|
Description: This test pin is not recommended for use.
3. Electrical Parameters
3.1 Absolute electrical parameters
Table 3,Absolute Parameters
|Parameters||Description||Minimum value||Maximum value||Unit|
|Electrostatic discharge voltage (human-body model)||TAMB-25℃||-||2.5||KV|
|Electrostatic discharge voltage (machine model)||TAMB-25℃||-||0.5||KV|
3.2 Operating conditions
Table 4,Normal operating conditions
|VIL||IO low input||-0.3||-||VCC*0.25||V|
|VIH||IO high input||VDD*0.75||-||VCC||V|
|VOL||IO low output||-||-||VCC*0.1||V|
|VOH||IO high output||VDD*0.8||-||VCC||V|
|Imax||IO drive current||-||-||12||mA|
3.3 Zigbee TX power consumption
Table 5, Power consumption during continuous TX
Note: When testing the above data, continuous transmission duty cycle=100%.
3.4 Zigbee RX power consumption
Table 6, RX continuous power
Note: When UART is active, the RX mode current is 8mA.
3.5 Power consumption in operating
Table 7, TYZS6 operating current
|Operation Mode||Operating condition, TA=25℃||Ave||Max||Unit|
|Quick configuration||Module in quick configuration state||10||40||mA|
|Network connection idle||Connected to a network||-||-||mA|
|Deep sleep mode||Deep sleep mode and retains 64KB Flash||2.7||4||uA|
4. RF Characteristics
4.1 Basic RF characteristics
Table 8,Basic RF characteristics
|Physical layer standard||IEEE 802.15.4|
|Data transfer rate||250Kbps|
|Antenna type||PCB antenna|
|Line of sight||>100m|
4.2 Zigbee output performance
Table 9, Continuous TX performance
|Output power adjustment step||-||0.5||1||dB|
|Output adjacent channel suppression||-31||dBc|
Note: The maximum output power of a typical module is limited to +10dBm by software.
4.3 Zigbee RX sensitivity
Table 10,RX Sensitivity
|PER<10%, RX sensitivity, 250Kbps@OQPSK||-||-102||-||dBm|
5. Antenna Signal
Default PCB onboard antenna connection.
5.2 Antenna interference reduction
To optimize Zigbee performance of the wireless module in combination with the PCB onboard antenna, it is recommended to keep the antenna at least 15mm from other metal parts. The user PCB board should not be routed around the antenna area and should not be covered with copper to avoid affecting the antenna radiation performance. It is recommended that
6. Packaging information and production guidance
6.1 Mechanical dimensions
6.2 PCB recommended packaging
Note: Pin 2/4/6/8/10 pair The row of pins on the front of the module; pins 1/3/5/7/9/11 correspond to the row of pins on the back of the module.
6.3 Production guide
The storage conditions for the module after it has been shipped are as follows:
- The moisture resistant bag must be stored at a temperature below 30℃ and under a relative humidity below 85%.
- The shelf life of dry packed products is six months following the packaged date. Important information
- All line workers must wear anti-static wrist straps throughout the entire production process.
- It is strictly prohibited to allow a module to come into contact with water or other contaminants during operations.
6.4 Recommended furnace temperature curve