WB3L Module Datasheet

Last Updated on2020-04-28 01:18:52

Product Overview

WB3L is a low-power embedded Wi-Fi and BLE module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3L is embedded with a low-power Arm Cortex-M4 microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripherals. WB3L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC andTCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • Dominant frequency: 120 MHz
  • Working voltage: 3.0 V to 3.6 V
  • Peripherals: 8 GPIOs
  • Wi-Fi connectivity
    • 802.11 b/g/n
    • Channels 1 to 14 at 2.4 GHz
    • WPA and WPA2 security modes
    • Up to +17 dBm output power in 802.11b mode
    • STA, AP, and STA+AP working modes
    • EZ and AP net pairing modes for Android and iOS devices
    • Onboard PCB antenna with a gain of 1.2 dBi
    • Working temperature: –40°C to +105°C
  • BLE connectivity
    • Support for Bluetooth 4.0
    • Maximum output power of +6 dBm
    • Onboard PCB antenna with a gain of 1.2 dBi

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change History

No.DateChange DescriptionVersion After Change
12019-11-17This is the first release.V1.0.0

Module Interfaces

Dimensions and Footprint

WB3L has two rows of pins with a 2±0.1 mm pin spacing.

The WB3L dimensions (H x W x D) are 2.8±0.15 mm x 16±0.35 mm x 24±0.35 mm. Figure shows the WB3L front and rear views.

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Interface Pin Definition

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Pin No.SymbolI/O TypeFunction
1RSTI/OReset pin, which is disconnected
2ADCAIADC pin, which is connected to the P23 pin on the internal IC
3ENIModule enabling pin, which is connected to 3.3 V for normal use
4P14I/OCommon I/O pin, which is connected to the P14 pin on the internal IC
5PWM5I/OHardware PWM pin, which is connected to the P26 pin on the internal IC
6PWM4I/OHardware PWM pin, which is connected to the P24 pin on the internal IC
7PWM0I/OHardware PWM pin, which is connected to the P6 pin on the internal IC
8VCCPPower supply pin (3.3 V)
9GNDPGround pin
10PWM3I/OHardware PWM pin, which is connected to the P9 pin on the internal IC
11TXD2I/OUART2_TX, which is connected to the P0 pin on the internal IC
12P16I/OCommon I/O pin, which is connected to the P16 pin on the internal IC
13PWM2I/OHardware PWM pin, which is connected to the P8 pin on the internal IC
14PWM1I/OHardware PWM pin, which is connected to the P7 pin on the internal IC
15RXD1I/OSerial interface receiving pin (UART_RX), which is connected to the P10 pin on the internal IC
16TXD1I/OSerial interface transmission pin (UART_TX), which is connected to the P11 pin on the internal IC

Note:P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.

Test Pin Definition

Pin No.SymbolI/O TypeFunction
TP6U2_RXDI/OUART2_RX, which is connected to the P1 pin on the internal IC
TP2F_SCKI/OClock pin when data is downloaded from the flash memory, which is connected to the P20 pin on the internal IC
TP3F_CSNI/OCommand enabling pin when data is downloaded from the flash memory, which is connected to the P21 pin on the internal IC
TP5F_SOI/OData input pin when data is downloaded from the flash memory, which is connected to the P22 pin on the internal IC

Electrical Parameters

Absolute Electrical Parameters

ParameterDescriptionMinimum ValueMaximum ValueUnit
TsStorage temperature-40105
VBATPower supply voltage3.03.6V
Static electricity voltage (human body model)TAMB-25℃-2KV
Static electricity voltage (machine model)TAMB-25℃-0.5KV

Working Conditions

ParameterDescriptionMinimum ValueTypical ValueMaximum ValueUnit
TaWorking temperature-40-105
VBATPower supply voltage3.03.33.6V
VILI/O low-level input-0.3-VCC*0.25V
VIHI/O high-level inputVCC*0.75-VCCV
VOLI/O low-level output--VCC*0.1V
VoHI/O high-level outputVCC*0.8-VCCV
ImaxI/O drive current--12mA

Current consumption during constant transmission and receiving

Working StatusModeRateTX Power/ ReceivingTypical ValueMaximum ValueUnit
TX11b11Mbps+17dBm295354mA
TX11g54Mbps+13.5dBm266300mA
TX11nMCS7+13dBm260290mA
RX11b11MbpsConstant receiving98100mA
RX11g54MbpsConstant receiving98100mA
RX11nMCS7Constant receiving98100mA

Working Current

Working ModeWorking Status (Ta = 25°C)Average ValueMaximum ValueUnit
EZThe module is in EZ mode, and the Wi-Fi indicator blinks quickly.95402mA
APThe module is in AP mode, and the Wi-Fi indicator blinks slowly.106386mA
ConnectedThe module is connected to the network, and the Wi-Fi indicator is steady on.55132mA
DisconnectedThe module is disconnected from the network, and the Wi-Fi indicator is steady off.38206mA

RF Features

Basic RF Features

ParameterDescription
Frequency band2.412~2.484GHz
Wi-Fi standardIEEE 802.11b/g/n(channels1-14)
Data transmission rate11b:1,2,5.5, 11 (Mbps); 11g:6,9,12,18,24,36,48,54(Mbps); 11n: HT20 MCS07; HT40 MCS07
Antenna typePCB antenna with a gain of 1.2 dBi

TX Performance

Performance during constant transmission

ParameterMinimum ValueTypical ValueMaximum ValueUnit
Average RF output power,802.11b CCK Mode 11M-16-dBm
Average RF output power,802.11g OFDM Mode 54M-14-dBm
Average RF output power,802.11n OFDM Mode MCS7-12-dBm
Frequency error-10-10ppm

RX Performance

RX sensitivity

ParameterMinimum ValueTypical ValueMaximum ValueUnit
PER<8%,RX sensitivity,802.11b DSSS Mode 11M--85-dBm
PER<10%,RX sensitivity,802.11g OFDM Mode 54M--72-dBm
PER<10%,RX sensitivity,802.11n OFDM Mode MCS7--68-dBm

Antenna Information

Antenna Type

WB3L uses an onboard PCB antenna.

Antenna Interference Reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. The following describes three antenna placement solutions: 1.Place the antenna outside the PCB frame. 2.Place the antenna along the PCB frame without copper nearby. 3. Place the antenna in a carved area on the PCB. The preceding solutions ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance. image.png

Packaging Information and Production Instructions

Mechanical Dimensions

The PCB dimensions (W x L x H) are 16±0.35mm (W)×24±0.35mm (L) ×2.8±0.15mm (H)。

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Side view

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Recommended Schematic Encapsulation

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Recommended PCB Encapsulation-Pin header

WB3L can be mounted onto a PCB by using an SMT placement machine or through-hole mounted onto the PCB through a pin header.

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Recommended PCB Encapsulation-SMT

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Production Instructions

  1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module. A.SMT placement equipment: a)Reflow soldering machine; b)Automated optical inspection (AOI) equipment; c)Nozzle with a 6 mm to 8 mm diameter; B. Baking equipment: a)Cabinet oven; b)Anti-static heat-resistant trays; c)Anti-static heat-resistant gloves;
  2. Storage conditions for a delivered module are as follows:: A.The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%. B.The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed. C.The package contains a humidity indicator card (HIC). 图片10

  3. Bake a module based on HIC status as follows when you unpack the module package: A.If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. B. If the 30% circle is pink, bake the module for 4 consecutive hours. C.If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. D.If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

  4. Baking settings: A.Baking temperature:125±5℃; B.Alarm temperature:130℃; C.SMT placement ready temperature after natural cooling: < 36°C; D.Number of drying times: 1; E.Rebaking condition: The module is not soldered within 12 hours after baking. 5.Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
  5. Before SMT placement, take electrostatic discharge (ESD) protective measures.
  6. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Recommended Oven Temperature Curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

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Storage Conditions

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MOQ and Packing Information

Product ModelMOQ(pcs)Packing MethodNumber of Modules in Each Reel PackNumber of Reel Packs in Each Box
WB3L4000Carrier tape and reel packing10004

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

—Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

Important Note

This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

This device have got a FCC ID:2ANDL-WB3L.The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WB3L”

This device is intended only for OEM integrators under the following conditions:

1)The antenna must be installed such that 20cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European notice

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Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com

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This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead,it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.